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ds-ixd_604 - r02 www.clare.com 1 rohs 2002/95/ec e 3 pb features ? 4a peak source/sink drive current ? wide operating voltage range: 4.5v to 35v ? -40c to +125c extended operating temperature range ? logic input withstands negative swing of up to 5v ? matched rise and fall times ? low propagation delay time ? low, 10 a supply current ? low output impedance applications ? efficient power mosfet and igbt switching ? switch mode power supplies ? motor controls ? dc to dc converters ? class-d switching amplifiers ? pulse transformer driver description the ixdd604/ixdf604/ixdi604/ixdn604 dual high-speed gate drivers are especially well suited for driving the latest ixys mosfets and igbts. each of the two outputs can source and sink 4a of peak current while producing voltage rise and fall times of less than 10ns. the input of each driver is virtually immune to latch up, and proprietary circuitry eliminates cross conduction and current ?shoot-through.? low propagation delay and fast, matched rise and fall times make the ixd_604 family ideal for high-frequency and high-power applications. the ixdd604 is a dual non-inverting driver with an enable. the ixdn604 is a dual non-inverting driver, the ixdi604 is a dual inverting driver, and the ixdf604 has one inverting driver and one non-inverting driver. the ixd_604 family is available in a standard 8-pin dip (pi), 8-pin soic (sia), 8-pin power soic with an exposed metal back (si), and an 8-pin dfn (d2) package. ordering information part number logic configuration package type packing method quantity IXDD604D2TR 8-pin dfn tape & reel 2000 ixdd604pi 8-pin dip tube 50 ixdd604si 8-pin power soic with exposed metal back tube 100 ixdd604sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdd604sia 8-pin soic tube 100 ixdd604siatr 8-pin soic tape & reel 2000 ixdf604pi 8-pin dip tube 50 ixdf604si 8-pin power soic with exposed metal back tube 100 ixdf604sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdf604sia 8-pin soic tube 100 ixdf604siatr 8-pin soic tape & reel 2000 ixdi604pi 8-pin dip tube 50 ixdi604si 8-pin power soic with exposed metal back tube 100 ixdi604sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdi604sia 8-pin soic tube 100 ixdi604siatr 8-pin soic tape & reel 2000 ixdn604pi 8-pin dip tube 50 ixdn604si 8-pin power soic with exposed metal back tube 100 ixdn604sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdn604sia 8-pin soic tube 100 ixdn604siatr 8-pin soic tape & reel 2000 e n a i n a e n b i n b outa outb a b i n a i n b a b outa outb i n a i n b a b outa outb i n a i n b outa outb a b ixd_604 4-ampere dual low-side ultrafast mosfet drivers
ixd_604 r02 www.clare.com 2 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.5 electrical characteristics: t a = 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 electrical char acteristics: - 40c t a +125c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.7 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. ixd_604 performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 characteristics test diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. block diagrams & truth tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 ixdd604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 ixdi604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.3 ixdf604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.4 ixdn604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4. typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.1 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.2 esd sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.3 reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.4 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
ixd_604 r02 www.clare.com 3 1 specifications 1.1 pin configurations 1.2 pin definitions 1.3 absolute maximum ratings absolute maximum electrical ratings are at 25c absolute maximum ratings are stress rating s. stresses in excess of these ratings c an cause permanent damage to the device. functional operation of the device at condit ions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 recommended operating conditions ixdd604pi/si/sia e n a i n a g n d i n b e n b outa v cc outb 1 4 3 2 8 5 6 7 a b ixdf604pi/si/sia n c i n a g n d i n b n c outa v cc outb 1 4 3 2 8 5 6 7 a b ixdi604pi/si/sia n c i n a g n d i n b n c outa v cc outb 1 4 3 2 8 5 6 7 a b ixdn604pi/si/sia n c i n a g n d i n b n c outa v cc outb 1 4 3 2 8 5 6 7 a b ixdd604d2 e n a i n a i n b e n b outa g n d v cc outb a 1 4 3 2 8 5 6 7 b pin name description ina channel a logic input inb channel b logic input ena channel a enable input - drive pin low to disable channel a and force channel a output to a high impedance state enb channel b enable input - drive pin low to disable channel a and force channel a output to a high impedance state outa outa channel a output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt outb outb channel b output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt v cc supply voltage - provides power to the device gnd ground - common ground reference for the device parameter symbol minimum maximum units supply voltage v cc -0.3 40 v input voltage v inx , v enx -5 v cc +0.3 v output current i out -4a junction temperature t j -55 +150 c storage temperature t stg -65 +150 c parameter symbol minimum maximum units supply voltage v cc 4.5 35 v operating temperature range t a -40 +125 c
ixd_604 4 www.clare.com r02 1.5 electrical characteristics: t a = 25c test conditions: 4.5v < v cc < 35v, one channel (unless otherwise noted). 1.6 electrical characteristics: - 40c t a +125c test conditions: 4.5v < v cc < 35v, one channel (unless otherwise noted). parameter conditions symbol minimum typical maximum units input voltage, high 4.5v < v cc < 18v v ih 3.0 - - v input voltage, low 4.5v < v cc < 18v v il --0.8 input current 0v < v in < v cc i in --10 a high en input voltage ixdd604 only v enh 2/3v cc -- v low en input voltage ixdd604 only v enl -- 1/3v cc output voltage, high - v oh v cc -0.025 -- v output voltage, low - v ol - - 0.025 output resistance, high state v cc =18v, i out =-10ma r oh -1.32.5 output resistance, low state v cc =18v, i out =10ma r ol -1.12 output current, continuous limited by package power dissipation i dc --1a rise time v cc =18v, c load =1000pf t r -916 ns fall time v cc =18v, c load =1000pf t f -814 on-time propagation delay v cc =18v, c load =1000pf t ondly -2950 off-time propagation delay v cc =18v, c load =1000pf t offdly -3550 enable to output-high delay time ixdd604 only, v cc =18v t enoh -3555 disable to high impedance state delay time ixdd604 only, v cc =18v t dold -4055 enable pull-up resistor - r en -200-k power supply current v cc =18v, v in =3.5v i cc -13ma v cc =18v, v in =0v -<110 a v cc =18v, v in =v cc -<110 parameter conditions symbol minimum maximum units input voltage, high 4.5v < v cc < 18v v ih 3.1 - v input voltage, low 4.5v < v cc < 18v v il -0.65 input current 0v < v in < v cc i in -10 10 a output voltage, high - v oh v cc -0.025 - v output voltage, low - v ol -0.025 output resistance, high state v cc =18v, i out =-10ma r oh -3 output resistance, low state v cc =18v, i out =10ma r ol -2.5 output current, continuous limited by package power dissipation i dc -1a rise time v cc =18v, c load =1000pf t r -16 ns fall time v cc =18v, c load =1000pf t f -14 on-time propagation delay v cc =18v, c load =1000pf t ondly -65 off-time propagation delay v cc =18v, c load =1000pf t offdly -65 enable to output-high delay time ixdd604 only, v cc =18v t enoh -65 disable to high impedance state delay time ixdd604 only, v cc =18v t dold -65 power supply current v cc =18v, v in =3.5v i cc -3.5ma v cc =18v, v in =0v -150 a v cc =18v, v in =v cc -150
ixd_604 r02 www.clare.com 5 1.7 thermal characteristics 2 ixd_604 performance 2.1 timing diagrams 2.2 characteristics test diagram package parameter symbol rating units d2 (8- pin dfn) thermal resistance, junction-to-ambient ja 35 c/w pi (8-pin dip) 125 si (8- pin power soic) 85 sia (8- pin soic) 120 si (8- pin power soic) thermal resistance, junction-to-case jc 10 c/w 10% 90% t ondly t offdly t f t r v ih v il i n x outx 10% 90% t ondly t offdly t r t f v ih v il i n x outx e n ae n b i n a outa g n d v cc i n b outb v cc + - v i n 0.1 f10 f c load tektronix c u rrent pro b e 6302 tektronix c u rrent pro b e 6302 c load
ixd_604 6 www.clare.com r02 3 block diagrams & truth tables 3.1 ixdd604 3.2 ixdi604 3.3 ixdf604 3.4 ixdn604 in x en x out x 0 1 or open 0 1 1 or open 1 00 z 10 z in x out x 0 1 1 0 200k e n a i n a g n d i n b e n b outa v cc outb v cc v cc ixdd604 200k v cc i n a g n d i n b outa v cc outb v cc ixdi604 ina outa 0 1 1 0 inb outb 0 0 1 1 in x out x 0 0 1 1 i n a g n d i n b outa v cc outb v cc ixdf604 i n a g n d i n b outa v cc outb v cc ixdn604
ixd_604 r02 www.clare.com 7 4 typical perform ance characteristics supply volta g e (v) 0 5 10 15 20 25 30 35 40 rise time (ns) 0 20 40 60 8 0 100 120 a&b rise times vs. supply volta g e (input=0-5v, f=10khz, t a =25oc) c l =10nf c l =1nf c l =470pf supply volta g e (v) 0 5 10 15 20 25 30 35 40 fall time (ns) 0 20 40 60 8 0 100 120 a&b fall times vs. supply volta g e (input=0-5v, f=10khz, t a =25oc) c l =10nf c l =1nf c l =470pf temperature (oc) -40-200 204060 8 0 100 120 140 rise & fall times (ns) 4 5 6 7 8 9 10 a&b rise and fall times vs. temperature (input=0-5v, v cc =18v, c l =1nf) t r t f load capacitance (pf) 0 2000 4000 6000 8 000 10000 rise time (ns) 0 20 40 60 8 0 100 120 a&b rise time vs. load capacitance at various v cc levels v cc =4.5 v v cc = 8v v cc =12 v v cc =1 8v v cc =24 v v cc =35 v load capacitance (pf) 0 2000 4000 6000 8 000 10000 fall time (ns) 0 20 40 60 8 0 100 120 a&b fall time vs. load capacitance at various v cc levels v cc =4.5 v v cc = 8v v cc =12 v v cc =1 8v v cc =24 v v cc =35 v supply volta g e (v) 0 5 10 15 20 25 30 35 propa g ation delay (ns) 20 40 60 8 0 100 120 140 160 propa g ation delay vs. supply volta g e (v in =0-5v, c l =1nf, f=1khz) t offdly t ondly input volta g e (v) 246 8 10 12 propa g ation delay (ns) 20 30 40 50 60 70 propa g ation delay vs. input volta g e (v cc =15v, c l =1nf) t ondly t offdly temperature (oc) -40-200 204060 8 0 100 120 140 propa g ation delay (ns) 20 25 30 35 40 45 50 propa g ation delay vs. temperature t offdly t ondly temperature (oc) -40 -20 0 20 40 60 8 0100120140 input threshold volta g e (v) 1.7 1.9 2.1 2.3 2.5 2.7 2.9 input threshold volta g e vs. temperature (v cc =18v, c l =1nf) min v ih max v il supply volta g e (v) 0 5 10 15 20 25 30 35 input threshold (v) 1.4 1.6 1. 8 2.0 2.2 2.4 2.6 2. 8 3.0 3.2 input threshold vs. supply volta g e v ih v il supply volta g e (v) 0 5 10 15 20 25 30 35 enable threshold (v) 0 2 4 6 8 10 12 14 16 1 8 20 22 enable threshold vs. supply volta g e v e n h v e n l
ixd_604 8 www.clare.com r02 load capacitance (pf) 100 1000 10000 supply current (ma) 1 10 100 1000 supply current vs. load capacitance both outputs active (v cc =35v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz load capacitance (pf) 100 1000 10000 supply current (ma) 0 50 100 150 200 250 300 350 400 supply current vs. load capacitance both outputs active (v cc =18v) f=1mhz f=500khz f=100khz f=50khz f=2mhz load capacitance (pf) 100 1000 10000 supply current (ma) 0 50 100 150 200 250 300 350 400 supply current vs. load capacitance both outputs active (v cc =12v) f=2mhz f=1mhz f=500khz f=100khz f=50khz load capacitance (pf) 100 1000 10000 supply current (ma) 0 50 100 150 200 250 300 350 supply current vs. load capacitance both outputs active (v cc =8v) f=2mhz f=1mhz f=500khz f=100khz f=50khz frequency (khz) 1 10 100 1000 10000 supply current (ma) 1 10 100 1000 supply current vs. frequency both outputs active (v cc =35v) c l =10nf c l =1nf c l =470pf frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.1 1 10 100 1000 supply current vs. frequency both outputs active (v cc =18v) c l =10nf c l =1nf c l =470pf frequency (khz) 1 10 100 1000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency both outputs active (v cc =12v) c l =10nf c l =1nf c l =470pf frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency both outputs active (v cc =8v) c l =10nf c l =1nf c l =470pf temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 supply current (ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 quiesent supply current vs. temperature (v cc =18v) v i n =3.5 v v i n =5 v v i n =10 v v i n =0 v & 1 8v temperature (oc) -40 -20 0 20 40 60 8 0 100 120 140 supply current (ma) 0.0 0.2 0.4 0.6 0. 8 1.0 1.2 1.4 dynamic supply current vs. temperature (v cc =18v, v in =5v, f=1khz, c l =1nf) supply volta g e (v) 0 5 10 15 20 25 30 35 output source current (a) 0 -2 -4 -6 - 8 -10 output source current vs. supply volta g e (c l =10nf) supply volta g e (v) 0 5 10 15 20 25 30 35 output sink current (a) 0 2 4 6 8 10 output sink current vs. supply volta g e (c l =10nf)
ixd_604 r02 www.clare.com 9 temperature (oc) -40-200 204060 8 0 100 120 140 output source current (a) 2 3 4 5 6 output source current vs. temperature (v cc =18v, c l =10nf) temperature (oc) -40-200 204060 8 0 100 120 140 output sink current (a) 2.0 3.0 4.0 5.0 6.0 output sink current vs. temperature (v cc =18v, c l =10nf) supply volta g e (v) 0 5 10 15 20 25 30 35 resistance ( ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 hi g h state output resistance vs. supply volta g e (i out = -10ma) supply volta g e (v) 0 5 10 15 20 25 30 35 resistance ( ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 low state output resistance vs. supply volta g e (i out = +10ma)
ixd_604 10 www.clare.com r02 5 manufacturing information 5.1 moisture sensitivity all plastic encapsulated se miconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated device s for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and informat ion in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 5.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 5.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device moisture sensitivity level (msl) rating ixd_604si / ixd_604sia / ixd_604pi msl 1 ixd_604d2 msl 3 device maximum temperature x time ixd_604si / ixd_604sia / ixd_604d2 260c for 30 seconds ixd_604pi 250c for 30 seconds rohs 2002/95/ec e 3 pb
ixd_604 r02 www.clare.com 11 5.4 mechanical dimensions 5.4.1 sia (8- pin soic) 5.4.2 si (8- pin power soic with exposed metal back) recommended pcb land pattern dimensions mm mi n / mm max (inches mi n / inches max) 1.30 / 1.75 (0.051 / 0.069) 0.10 / 0.25 (0.004 / 0.010) 4. 8 0 / 5.00 (0.190 / 0.197) pi n 1 0.31 / 0.51 (0.012 / 0.020) 5. 8 0 / 6.20 (0.22 8 / 0.244) 3. 8 0 / 4.00 (0.150 / 0.157) 1.27 bsc (0.05 bsc) 0.40 / 1.27 (0.016 / 0.050) 0.10 / 0.25 (0.004 / 0.010) 0.25 / 0.50 x45o (0.010 / 0.020 x45o) 0o / 8 o 1.27 (0.050) 5.40 (0.213) 1.55 (0.061) 0.60 (0.024) n ote: molded package conforms to jedec standard config u ration ms-012 v ariation aa. recommended pcb land pattern dimensions mm mi n / mm max (inches mi n / inches max) n otes: 1. molded package conforms to jedec standard config u ration ms-012 v ariation ba. 2. the exposed metal pad on the b ack of the si package may b e left floating or connected to g n d. it is not s u ita b le for carrying c u rrent. 1.30 / 1.75 (0.051 / 0.069) 0.03 / 0.10 (0.001 / 0.004) 4. 8 0 / 5.00 (0.190 / 0.197) pi n 1 0.31 / 0.51 (0.012 / 0.020) 5. 8 0 / 6.20 (0.22 8 / 0.244) 3. 8 0 / 4.00 (0.150 / 0.157) 1.27 bsc (0.05 bsc) 0.40 / 1.27 (0.016 / 0.050) 0.10 / 0.25 (0.004 / 0.010) 0.25 / 0.50 x45o (0.010 / 0.020 x45o) 0o / 8 o 2.29 / 2.79 (0.090 / 0.110) 3.30 / 3. 8 1 (0.130 / 0.150) 1.27 (0.050) 5.40 (0.209) 1.55 (0.061) 0.60 (0.024) 2.75 (0.10 8 ) 3. 8 0 (0.150)
ixd_604 12 www.clare.com r02 5.4.3 tape & reel information for si and sia packages 5.4.4 pi (8-pin dip) n otes: 1. a 0 & b 0 meas u red at 0.3mm a b o v e b ase of pocket. 2. 10 pitches c u m u lati v e tol. 0.2mm 3. ( ) reference dimensions only. 4. unless other w ise specified, all dimensions in millimeters. k 0 =2.30 0.10 b 0 =5.20 0.10 r0.50 typ 8 .00 0.10 2.00 0.10 4.00 0.10 see n ote #2 12.00 0.30 5.50 0.10 1.75 0.10 ? 1.50 (mi n ) ? 1.55 0.05 1. 8 0 0.10 (3.40) 0.30 0.05 (70o) a 0 =6.40 0.10 (4.70) (1.20) a a b b sectio n a-a sectio n b-b em b ossment em b ossed carrier to p c o v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) dimensions mm mi n / mm max (inches mi n / inches max) n ote: molded package conforms to jedec standard config u ration ms-001 v ariation ba. pc board pattern 7.62 / 10.92 (0.300 / 0.430) 7.62 bsc (0.300 bsc) 0.20 / 0.3 8 (0.00 8 / 0.015) 7.37 / 8 .26 (0.290 / 0.325) 0.3 8 / 0.5 8 (0.015 / 0.023) 1.14 / 1.65 (0.045 / 0.065) 0.3 8 / 1.02 (0.015 / 0.040) 3.05 / 3. 8 1 (0.120 / 0.150) 3.43 / 4.70 (0.135 / 0.1 8 5) 3.1 8 / 3. 8 1 (0.125 / 0.150) 8 -0.900 dia. ( 8 -0.035 dia.) 7.50 (0.295) 2.540 (0.100) 9.02 / 10.16 (0.355 / 0.400) 6.10 / 6. 8 6 (0.240 / 0.270) 2.540 bsc (0.100 bsc) 1.40 (0.055)
ixd_604 r02 www.clare.com 13 5.4.5 d2 (8- pin dfn) 5.4.6 tape & reel information for d2 package dimensions mm mi n / mm max (inches mi n / inches max) 5.00 bsc (0.197 bsc) 4.00 bsc (0.15 8 bsc) 0. 8 0 / 1.00 (0.031 / 0.039) 0.00 / 0.05 (0.000 / 0.002) 0.95 bsc (0.037 bsc) 0.76 / 0. 8 1 (0.030 / 0.032) 0.30 / 0.45 (0.012 / 0.01 8 ) 3.04 / 3.09 (0.120 / 0.122) 2.54 / 2.59 (0.100 / 0.102) 0.35 / 0.45 x 45o (0.014 / 0.01 8 x 45o) pin 1 pin 1 pin 8 0.20 ref (0.00 8 ref) recommended pcb land pattern 4.50 (0.177) 0.45 (0.01 8 ) 1.20 (0.047) 3.05 (0.120) 2.55 (0.100) 0.95 (0.037) 0.35 x 45o (0.014 x 45o) n ote: the exposed metal pad on the b ack of the d2 package may b e left floating or connected to gro u nd. it is not s u ita b le for carrying c u rrent. k 0 =1.90 0.10 b 0 =5.40 0.10 5o max a 0 =4.25 0.10 5o max 0.30 0.05 (0.05) (0.05) r0.75 typ 8 .00 0.10 2.00 0.05 4.00 0.10 see n ote #2 12.00 0.30 5.50 0.05 1.75 0.10 ? 1.50 (mi n ) ? 1.55 0.05 n otes: 1. a 0 & b 0 meas u red at 0.3mm a b o v e b ase of pocket. 2. 10 pitches c u m u lati v e tol. 0.2mm 3. ( ) reference dimensions only. 4. unless other w ise specified, all dimensions in millimeters. em b ossment em b ossed carrier to p c o v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) for additional information please vi sit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-ixd_604-r02 ?copyright 2010, clare, inc. all rights reserved. printed in usa. 12/3/2010

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